Address packing on ET200 SP

Hello,

I'm working on an hardware configuration with the decentralized peripheral system of S7 1500 (ET200 SP) using Tia Portal V13 SP1, and I'm not able to pack addresses (the function is disabled, when I right-click on the modules whose addresses I wish to pack the option is greyed).

I was not able to find official documentation from Siemens on this matter, therefore I searched through this forum, finding opposite statements on the matter. Indeed in this topic a user said that:

unknown user

it is not possible to pack adresses with ET200SP, because it is an other adressing method

 while another one objects saying:

unknown user

For distributed IO (inteface modules) packing option is possible, like always before, while for the rack with ET200S, ET200SP CPU packing isn't possible

 Does someone has more information on the topic?

Hi,

in the technical data of a module / device you can read if device will support packing the adresses.

Towome

From what I can see from the hardware catalog in ET200 SP there is only one interface module, called IM155-6, that comes with three different flavors  (ST, ST SIPLUS and HF), and none of them seem to support address packing. Therefore I think that it is possible to say that ET200 SP doesn't provide address packing, regardless of the module you choose. I just wanted to know if this is correct.

hi dan,

you are right. ET200SP doesn´t support Adress-Packing. 

But this theme occurs very often, because with the very first releases of HSP and the SP with Step7 5.5 it was possible to project it. But it didn´t work, it was only possible to project it. And if Siemens don´t changes the adressing-method, it won´t be possible in future, too.

regards, 

Hi there,

The pack address feature is not necessarily related to the ET 200 interface module type. Its more to do with the I/O module

In the ET 200S, for example, you have I/O modules that have channels less than a byte (8 bits), e.g. 2 bits, 4 bits etc.

Because your S7 system uses the byte for addressing modules, the remaining bits in a 2 bit or 4 bit I/O module are lost. When you insert the next I/O module, the address starts from the next Byte.

The idea behind "pack address" is to address a module from the next available Bit instead of Byte. This saves the address space.

To test this, configure an ET 200S and insert 8 bit I/O modules. Select the modules and right-click; you will notice that the "pack addresses" option is not available.

Replace the 8 bit I/O modules with 2 bit or 4 bit modules - the "pack addresses" option is available

Bonsu

Hi there,

The pack address feature is not necessarily related to the ET 200 interface module type. Its more to do with the I/O module

In the ET 200S, for example, you have I/O modules that have channels less than a byte (8 bits), e.g. 2 bits, 4 bits etc.

Because your S7 system uses the byte for addressing modules, the remaining bits in a 2 bit or 4 bit I/O module are lost. When you insert the next I/O module, the address starts from the next Byte.

The idea behind "pack address" is to address a module from the next available Bit instead of Byte. This saves the address space.

To test this, configure an ET 200S and insert 8 bit I/O modules. Select the modules and right-click; you will notice that the "pack addresses" option is not available.

Replace the 8 bit I/O modules with 2 bit or 4 bit modules - the "pack addresses" option is available

 hi,

nice expaination.

...but I guess in this Thread everybody knew what address-packing is, and how it works

The question was(2 years ago) if it is possible in ET200SP.

regards,