Hello Experts,

Hope everything is going well with you!

We are migrating one Step 7 project to TIA portal. The first hurdle was some ET200S module's compatibility issue with TIA portal which we resolved by instaling GSD files. Now the next problem we are facing with the assignment of the IO addresses to modules.

The DI module used in the Step 7 project are of 2 channels and address range assigned to them is from I4.0 to I4.1. So the next module range will be from I4.2 to I4.3 and so on. But while assigning addresses in TIA portal it is not allowing us to use the same strategy. For the first DI module, the starting address is 4 and for the next module, it is 5. But we need to use same IO addresses in the TIA portal otherwise it will create further issues. Also, pack addresses option is also disabled when I tried selecting two modules and pack it.

I have attached a file consisting screenshot of hardware configuration from both projects. Kindly let us know the way by which we can resolve the problem.

Thanks in advance.

Kind Regards,

Parag Zope.

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Split from Changing addresses of I/O modules.

Hello zopeparag;

Consider the suggestions from this doument on the address packing function for ET 200S modules:

How can you group together the address area of the ET 200S in STEP 7 (TIA Portal) using the "Pack Addresses" function?

https://support.industry.siemens.com/cs/ww/en/view/89855744

Hope this helps,

Daniel Chartier

dchartier

Hello zopeparag;

Consider the suggestions from this doument on the address packing function for ET 200S modules:

How can you group together the address area of the ET 200S in STEP 7 (TIA Portal) using the "Pack Addresses" function?

https://support.industry.siemens.com/cs/ww/en/view/89855744

Hope this helps,

Daniel Chartier

Hello Daniel,

Many thanks for your reply.

But I already tried doing the configuration as mentioned but it didn't work. Maybe because we are designing rack using the GSD file for ET200S module? As there is no issue of packing address with the rack designed without using the GSD file.

I have attached file for reference. Awaiting your valuable response.

Kind Regards,

Parag Zope. 

ChristophD

Hello,

GSD Device doesn't support "Packaking of Adresses", this only possible with the devices directly from the installed TIA Catalog.

Regards

Christoph

 Hello Christoph,

Thanks for the response.

So If GSD device doesn't support packing of addresses then how we can resolve this issue? Is there any other way to resolve it? If not then we have to reassign all I/O addresses in hardware configuration as well as in logic also and that will be a very tedious job for us.

Thanks & Regards,

Parag Zope.

ChristophD

delete hsd object and use HW catalog objects, this is the only way.

Hello,

It is not possible for us, because we are migrating an old project made in Step 7 to TIA portal, also swapping S7-400 PLC to S7-1500 PLC. Our client is asking us to use all existing hardware and some modules as follows are not compatible with TIA, (the reason for using GSD)

1. ET200S modules: 6ES7 151-1AA02-0AB0, 6ES7 151-1AA01-0AB0

2. Power modules: 6ES7 138-4CB10-0AB0

3. DO module: 6ES7 132-4HB00-0AB0

4. AI module: 6ES7 134-4GB10-0AB0, 6ES7 134-4GB10-0AB1

Any suggestions?

Thanks & Regards,

Parag Zope.

Hello,

When using the GSD you can use the variants of the modules with the asterisk symbol to pack the addresses.

With kind regards,

Tom